Bond Hewlett-Packard Inc. 3.4% ( US40434LAC90 ) in USD
Issuer | Hewlett-Packard Inc. | ||
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Interest rate | 3.4% per year ( payment 2 times a year) | ||
Maturity | 16/06/2030 | ||
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Minimal amount | 2 000 USD | ||
Total amount | 850 000 000 USD | ||
Cusip | 40434LAC9 | ||
Standard & Poor's ( S&P ) rating | BBB ( Lower medium grade - Investment-grade ) | ||
Moody's rating | Baa2 ( Lower medium grade - Investment-grade ) | ||
Next Coupon | 17/06/2025 ( In 49 days ) | ||
Detailed description |
HP Inc. is a multinational information technology company that develops and manufactures personal computing devices, printing and 3D printing systems, and related supplies and services. The Bond issued by Hewlett-Packard Inc. ( United States ) , in USD, with the ISIN code US40434LAC90, pays a coupon of 3.4% per year. The coupons are paid 2 times per year and the Bond maturity is 16/06/2030 The Bond issued by Hewlett-Packard Inc. ( United States ) , in USD, with the ISIN code US40434LAC90, was rated Baa2 ( Lower medium grade - Investment-grade ) by Moody's credit rating agency. The Bond issued by Hewlett-Packard Inc. ( United States ) , in USD, with the ISIN code US40434LAC90, was rated BBB ( Lower medium grade - Investment-grade ) by Standard & Poor's ( S&P ) credit rating agency. |