Bond AbbVie 3.375% ( US00287YBE86 ) in USD

Issuer AbbVie
Market price 100 %  ▼ 
Country  United States
ISIN code  US00287YBE86 ( in USD )
Interest rate 3.375% per year ( payment 2 times a year)
Maturity 13/11/2021 - Bond has expired



Prospectus brochure of the bond AbbVie US00287YBE86 in USD 3.375%, expired


Minimal amount 2 000 USD
Total amount 1 250 000 000 USD
Cusip 00287YBE8
Standard & Poor's ( S&P ) rating BBB+ ( Lower medium grade - Investment-grade )
Moody's rating Baa2 ( Lower medium grade - Investment-grade )
Detailed description AbbVie is a research-based biopharmaceutical company focused on developing and marketing innovative therapies in several key therapeutic areas including immunology, oncology, neuroscience, and ophthalmology.

The Bond issued by AbbVie ( United States ) , in USD, with the ISIN code US00287YBE86, pays a coupon of 3.375% per year.
The coupons are paid 2 times per year and the Bond maturity is 13/11/2021

The Bond issued by AbbVie ( United States ) , in USD, with the ISIN code US00287YBE86, was rated Baa2 ( Lower medium grade - Investment-grade ) by Moody's credit rating agency.

The Bond issued by AbbVie ( United States ) , in USD, with the ISIN code US00287YBE86, was rated BBB+ ( Lower medium grade - Investment-grade ) by Standard & Poor's ( S&P ) credit rating agency.







SECURITIES AND EXCHANGE COMMISSION
FORM FWP
Filing under Securities Act Rules 163/433 of free writing prospectuses
Filing Date: 2018-09-14
SEC Accession No. 0001104659-18-056723
(HTML Version on secdatabase.com)
SUBJECT COMPANY
Mailing Address
Business Address
AbbVie Inc.
1 NORTH WAUKEGAN ROAD 1 NORTH WAUKEGAN ROAD
CIK:1551152| IRS No.: 320375147 | State of Incorp.:DE | Fiscal Year End: 1231
NORTH CHICAGO IL 60064
NORTH CHICAGO IL 60064
Type: FWP | Act: 34 | File No.: 333-227316 | Film No.: 181069820
(847) 932-7900
SIC: 2834 Pharmaceutical preparations
FILED BY
Mailing Address
Business Address
AbbVie Inc.
1 NORTH WAUKEGAN ROAD 1 NORTH WAUKEGAN ROAD
CIK:1551152| IRS No.: 320375147 | State of Incorp.:DE | Fiscal Year End: 1231
NORTH CHICAGO IL 60064
NORTH CHICAGO IL 60064
Type: FWP
(847) 932-7900
SIC: 2834 Pharmaceutical preparations
Copyright © 2018 www.secdatabase.com. All Rights Reserved.
Please Consider the Environment Before Printing This Document


Filed pursuant to Rule 433
Dated September 13, 2018
Issuer Free Writing Prospectus supplementing the
Preliminary Prospectus Supplement dated
September 13, 2018 and the
Prospectus dated September 13, 2018
Registration No. 333-227316
AbbVie Inc.
Pricing Term Sheet
$1,250,000,000 3.375% Senior Notes due 2021 (the 2021 Notes)
$1,250,000,000 3.750% Senior Notes due 2023 (the 2023 Notes)
$1,750,000,000 4.250% Senior Notes due 2028 (the 2028 Notes)
$1,750,000,000 4.875% Senior Notes due 2048 (the 2048 Notes)
Terms Applicable to Each Series of the Notes
Issuer:
AbbVie Inc.
Trade Date:
September 13, 2018
Settlement Date:
September 18, 2018 (T+3)
Form of Offering:
SEC Registered (Registration No. 333-227316)
Joint Book-Running Managers:
Merrill Lynch, Pierce, Fenner & Smith
Incorporated
J.P. Morgan Securities LLC
Morgan Stanley & Co. LLC
BNP Paribas Securities Corp.
Barclays Capital Inc. (2028 Notes)
Citigroup Global Markets Inc. (2021 Notes)
Goldman Sachs & Co. LLC (2023 Notes)
HSBC Securities (USA) Inc. (2048 Notes)
Co-Managers:
Barclays Capital Inc. (2021 Notes, 2023 Notes, 2048 Notes)
Citigroup Global Markets Inc. (2023 Notes, 2028 Notes, 2048 Notes)
Goldman Sachs & Co. LLC (2021 Notes, 2028 Notes, 2048 Notes)
HSBC Securities (USA) Inc. (2021 Notes, 2023 Notes, 2028 Notes)
Credit Suisse Securities (USA) LLC
Deutsche Bank Securities Inc.
Mizuho Securities USA LLC
MUFG Securities Americas Inc.
RBC Capital Markets, LLC
Santander Investment Securities Inc.
SG Americas Securities, LLC
Wells Fargo Securities, LLC
Copyright © 2018 www.secdatabase.com. All Rights Reserved.
Please Consider the Environment Before Printing This Document


DNB Markets, Inc.
Lloyds Securities Inc.
The Williams Capital Group, L.P.
Interest Payment Dates:
November 14 and May 14, commencing May 14, 2019
Day Count Convention:
30 / 360
Terms Applicable to 3.375% Senior Notes due 2021
Aggregate Principal Amount:
$1,250,000,000
Final Maturity Date:
November 14, 2021
Public Offering Price:
99.828%, plus accrued and unpaid interest, if any, from September 18, 2018
Benchmark Treasury:
2.750% due 2021
Benchmark Treasury Price and Yield:
99-24 3/4 / 2.831%
Spread to Benchmark Treasury:
T+60 bps
Coupon:
3.375%
Yield to Maturity:
3.431%
Make-Whole Call:
Make-whole call at T+10 bps
CUSIP / ISIN:
00287Y BE8 / US00287YBE86
Terms Applicable to 3.750% Senior Notes due 2023
Aggregate Principal Amount:
$1,250,000,000
Final Maturity Date:
November 14, 2023
Public Offering Price:
99.872%, plus accrued and unpaid interest, if any, from September 18, 2018
Benchmark Treasury:
2.750% due 2023
Benchmark Treasury Price and Yield:
99-13+ /2.876%
Spread to Benchmark Treasury:
T+90 bps
Coupon:
3.750%
Yield to Maturity:
3.776%
Make-Whole Call:
Make-whole call at T+15 bps
Par Call:
On or after October 14, 2023
CUSIP / ISIN:
00287Y BC2 / US00287YBC21
Terms Applicable to 4.250% Senior Notes due 2028
Aggregate Principal Amount:
$1,750,000,000
Final Maturity Date:
November 14, 2028
Public Offering Price:
99.145%, plus accrued and unpaid interest, if any, from September 18, 2018
Benchmark Treasury:
2.875% due 2028
Benchmark Treasury Price and Yield:
99-05 / 2.974%
Spread to Benchmark Treasury:
T+138 bps
Coupon:
4.250%
Copyright © 2018 www.secdatabase.com. All Rights Reserved.
Please Consider the Environment Before Printing This Document


Yield to Maturity:
4.354%
Make-Whole Call:
Make-whole call at T+25 bps
Par Call:
On or after August 14, 2028
CUSIP / ISIN:
00287Y BF5 / US00287YBF51
Terms Applicable to 4.875% Senior Notes due 2048
Aggregate Principal Amount:
$1,750,000,000
Final Maturity Date:
November 14, 2048
Public Offering Price:
98.943%, plus accrued and unpaid interest, if any, from September 18, 2018
2
Benchmark Treasury:
3.125% due 2048
Benchmark Treasury Price and Yield:
100-08 / 3.112%
Spread to Benchmark Treasury:
T+183 bps
Coupon:
4.875%
Yield to Maturity:
4.942%
Make-Whole Call:
Make-whole call at T+ 30 bps
Par Call:
On or after May 14, 2048
CUSIP / ISIN:
00287Y BD0 / US00287YBD04
The Issuer has filed a registration statement (including a preliminary prospectus supplement and an accompanying prospectus)
with the Securities and Exchange Commission (SEC) for the offering to which this communication relates. Before you invest,
you should read the prospectus in that registration statement and other documents that the Issuer has filed with the SEC,
including the preliminary prospectus supplement, for more complete information about the Issuer and this offering. You may
get these documents for free by visiting the SEC website at www.sec.gov. Alternatively, the Issuer, any underwriter or any
dealer participating in the offering will arrange to send you the preliminary prospectus supplement and the accompanying
prospectus if you request it by contacting Merrill Lynch Fenner & Smith Incorporated toll-free at (800) 294-1322, J.P. Morgan
Securities LLC collect at (212) 834-4533, Morgan Stanley & Co. LLC toll-free at (866) 718-1649 or BNP Paribas Securities
Corp. toll-free at (800) 854-5674.
The Issuer expects to deliver the Notes against payment for the Notes on the third business day following the date of the pricing
of the Notes (T+3). Under Rule 15c6-1 of the Exchange Act, trades in the secondary market generally are required to settle
in two business days, unless the parties to a trade expressly agree otherwise. Accordingly, purchasers who wish to trade Notes on
the date of pricing will be required, by virtue of the fact that the Notes initially will settle in T+3, to specify alternative
settlement arrangements to prevent a failed settlement.
Terms used but not defined herein shall have the meanings ascribed thereto in the Issuers preliminary prospectus supplement,
dated September 13, 2018, to the Issuers prospectus, dated September 13, 2018.
3
Copyright © 2018 www.secdatabase.com. All Rights Reserved.
Please Consider the Environment Before Printing This Document


Document Outline